Passive Intermodulation (PIM) Testing

Why Clinton Nevada

All Low PIM cables assemblies are produced in a controlled environment in an AS9100/ISO/UL facility by certified technicians. Automated production equipment helps ensure consistent results. Every cable is inspected and tested using industry recognized equipment from Anritsu and Kaelus.

Low PIM cables

Test results are maintained in accordance with our quality program and provided on a flash drive to the customer.

Understanding PIM

Passive Intermodulation (PIM) is becoming more and more significant as wireless users demand data, with high speeds. It affects network speed and performance, therefore, needs to be monitored, making PIM testing a requirement, especially today. Clinton Nevada has been producing Low PIM cables assemblies and providing Low PIM components for years.

Low PIM Cables

What is PIM?

Passive Intermodulation occurs when two or more high power RF signals encounter non-linear electrical junctions or materials in an RF path. These non-linear junctions behave like a mixer causing new signals to be generated at mathematical combinations of the original RF inputs. When these PIM signals fall in the Rx band of the cell site the noise floor rises causing increased dropped calls, reduced data transmission rates and decreased system capacity. The impact of passive intermodulation on the network performance can be severe, especially for systems such as CDMA, UMTS or LTE. Causes of non-linear junctions include:

  • Contaminated surfaces or contacts due to dirt, dust, moisture or oxidation.
  • Loose mechanical junctions due to inadequate torque, poor alignment or poorly prepared contact surfaces.
  • Loose mechanical junctions caused transportation shock or vibration
  • Metal flakes or shavings inside RF connections.
  • Poorly prepared RF connections
  • Trapped dielectric materials (adhesives, foam, etc.)
  • Cracks or distortions at the end of the outer conductor of coaxial cables caused by over tightening the back nut during installation
  • Solid inner conductors distorted in the preparation process causing these to be out of round or tapered over the mating length.
  • Hollow inner conductors excessively enlarged or made oval during the preparation process.